{"database": "press", "table": "releases", "rows": [["https://stanton.house.gov/2024/7/stanton-applauds-400-million-direct-chips-act-funding-to-tempe-based-amkor-to-construct-advanced-packaging-and-test-facility-in-arizona", "Stanton Applauds $400 Million Direct CHIPS Act Funding to Tempe-Based Amkor to Construct Advanced Packaging and Test Facility in Arizona", "2024-07-26", "2024", "2024-07", "Democrat", "House", "AZ", "Greg Stanton", "S001211", "stanton.house.gov", "stanton", "https://stanton.house.gov/press-releases", "scraper", "WASHINGTON, D.C.\u2014Rep. Greg Stanton applauded the announcement today that the U.S. Department of Commerce and Tempe-based Amkor Technologies had signed a non-binding preliminary memorandum of terms (PMT) to provide up to $400 million in proposed direct funding under the CHIPS and Science Act.\n\nThis proposed funding would support Amkor\u2019s investment of approximately $2 billion and 2,000 jobs in a greenfield project in Peoria, Arizona, which will provide full end-to-end advanced packaging for the world\u2019s most advanced semiconductors for applications in high-performance computing, artificial intelligence, communications, and automotive, end markets.\n\nThis proposed investment in Amkor, the largest U.S.-based outsourced semiconductor assembly and test company (OSAT), will help strengthen resilience in key advanced packaging technologies\u2014improving U.S. economic and national security by ensuring a reliable domestic advanced packaging ecosystem, supporting leading-edge clusters, and helping meet the growing demand for AI chips.\n\nCompanies such as TSMC, Apple, and GlobalFoundries\u2014which power the world\u2019s most advanced technologies\u2014will be able to package and test their essential chips domestically, enabling the full end-to-end cycle of the chip manufacturing process to occur in the United States.\n\n\u201cArizona is continuing to lead the world in semiconductor innovation. Thanks to our CHIPS Act, Amkor is expanding their footprint with one of the first advanced packaging and testing facilities in the U.S.,\u201d said Rep. Stanton. \u201cSoon, microchips manufactured in Arizona will be packaged in Arizona \u2013 making our entire semiconductor supply chain more efficient and resilient, while creating good-paying jobs here in the state.\u201d\n\nStanton supported Amkor\u2019s application for funding under the CHIPS Act, leading his House and Senate colleagues in a letter to Secretary Raimondo earlier this year.\n\n\u201cOne of the fundamental goals of the CHIPS and Science Act is creating an advanced packaging ecosystem in the U.S. to ensure full start to finish chip production occurs domestically. Advanced packaging drives chip innovation at all levels, and because of President Biden\u2019s leadership, the U.S. will have a robust domestic footprint in this critical technology,\u201d said U.S. Secretary of Commerce Gina Raimondo. \u201cThe leading-edge chips that will be packaged right here in Arizona are foundational to technologies of the future that will define global economic and national security for decades to come. Thanks to the Biden-Harris Administration, and Amkor\u2019s investments in the U.S., this proposed funding would enhance our supply chain security, create thousands of jobs in Arizona, and further position the United States to out-innovate, out-build, and out-compete the rest of the world.\u201d", 1, "2026-03-30T01:40:41Z", "2026-04-07T21:24:45Z"]], "columns": ["url", "title", "date", "year", "month", "party", "chamber", "state", "member_name", "bioguide_id", "domain", "scraper", "source", "date_source", "text", "has_text", "collected_at", "updated_at"], "primary_keys": ["url"], "primary_key_values": ["https://stanton.house.gov/2024/7/stanton-applauds-400-million-direct-chips-act-funding-to-tempe-based-amkor-to-construct-advanced-packaging-and-test-facility-in-arizona"], "units": {}, "query_ms": 1.4482270926237106, "source": "dwillis/congress-press", "source_url": "https://github.com/dwillis/congress-press", "license": "MIT", "license_url": "https://github.com/dwillis/congress-press/blob/main/LICENSE"}